Rigid PCB Manufacture capability
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Item
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Manufacture capability
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Mass production
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Sample
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Max. dimension
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622*546mm(24.5”*21.5”)
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622*546mm(24.5”*21.5”)
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Copper thickness of inner layer
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1/2~5oz
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1/2~6oz
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Copper thickness of outer layer
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1/3~6oz
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1/3~8oz
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Min. Annular ring
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3mil
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2mil
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Min. solder mask bridge
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3mil
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2mil
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Min. solder mask clearance
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1.5mil
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1mil
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Impedance tolerance
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+/-10%
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+/-8%
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Finished board thickness
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0.25mm-3.5mm
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0.2mm-4.0mm
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Outline precision
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+/-0.1mm
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+/-0.08mm
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Surface finished type
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HASL(LF)、Flash gold、ENIG、OSP(Lead free compatible)、Carbon ink、Peelable S/M、Immersion Ag/Tin、Gold finger plating、ENIG+ Gold finger plating、Immersion Ag+ Gold finger plating
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HASL(LF)、Flash gold、ENIG、OSP(Lead free compatible)、Carbon ink、Peelable S/M、Immersion Ag/Tin、Gold finger plating、ENIG+ Gold finger plating、Immersion Ag/Tin+Gold finger plating、ENIG+OSP
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Production type
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High precision multi-layer board、Blind hole board、Buried hole board、High frequency board、Aluminum backed board、
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High precision multi-layer board、Blind hole board、Buried hole board、High frequency board、Aluminum base board、Copper base board、Ceramic board、HDI
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Base material
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FR-4、Aluminum/Cu base board 、Halogen-free 、lead free compatible 、Rogers、Teflon、High TG、 high CTI 、CEM-1、 CEM-3
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FR-4 、Aluminum/Cu base board 、Halogen-free 、lead free compatible 、High TG、 high CTI 、CEM-1、 CEM-3、copper base 、Ceramic base
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Layers
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1-16 layer
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1-20 layers
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Inner layer circuit(W/S)
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4/4mil
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3/3mil
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Outer layer(W/S)
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4/4mil
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3/3mil
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Inner layer board thickness
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0.1-1.6mm
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0.075mm-1.6mm
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Min.drill bit hole size
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0.2mm
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0.2mm
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Hole plating aspect ratio (max)
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8：1
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10：1
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Thermal shock test
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288℃，10S, 3X
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288℃，10S, 3X
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Telephone
E-mail
